產(chǎn)品系列
產(chǎn)品系列
LM3S611-EGZ50-C2
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Stellaris? ARM? Cortex?-M3S 600
Part Status : Discontinued at Digi-Key
Core Processor : ARM? Cortex?-M3
Core Size : 32-Bit
Speed : 50MHz
Connectivity : I2C, Microwire, SPI, SSI, UART/USART
Peripherals : Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O : 32
Program Memory Size : 32KB (32K x 8)
Program Memory Type : FLASH
RAM Size : 8K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 4x10b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 105°C (TA)
Mounting Type : Surface Mount
Package / Case : 48-VFQFN Exposed Pad
Supplier Device Package : 48-VQFN (7x7)
型號(hào) |
品牌 | 封裝 | 批號(hào) | 查看 | |
|---|---|---|---|---|---|
| SN75LVDS86ADGG | TI | 48-TSSOP | New | 詳細(xì) | |
| PCA9539PWG4 | TI | 24-TSSOP | New | 詳細(xì) | |
| SN74AS153DR | TI | 16-SOIC | New | 詳細(xì) | |
| SN74AUP1G34YZPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 詳細(xì) | |
| TMS320C6412AGDK7 | TI | 548-FC/CSP (23x23) | New | 詳細(xì) | |
| SN74LVTH646DGVR | TI | 24-TVSOP | New | 詳細(xì) | |
| SN74HC175D | TI | New | 詳細(xì) | ||
| SN74LV373ATPW | TI | 20-TSSOP | New | 詳細(xì) | |
| LM2575S-ADJ/NOPB | TI | DDPAK/TO-263-5 | New | 詳細(xì) | |
| LM3S1B21-IQC80-C3T | TI | 100-LQFP (14x14) | New | 詳細(xì) | |
| TLV117112DCYT | TI | SOT-223-4 | New | 詳細(xì) | |
| PCM1702U-K/2K | TI | 20-SO | New | 詳細(xì) | |
| MSP430P325IPM | TI | 64-LQFP (10x10) | New | 詳細(xì) | |
| LM3S1751-IQC50-A2T | TI | 100-LQFP (14x14) | New | 詳細(xì) | |
| LMP2022MAX/NOPB | TI | 8-SOIC | New | 詳細(xì) | |
| DAC8234SPFB | TI | 48-TQFP (7x7) | New | 詳細(xì) | |
| LP3985IM5X-3.3 | TI | SOT-23-5 | New | 詳細(xì) | |
| UCD7230RGWR | TI | 20-VQFN (5x5) | New | 詳細(xì) | |
| LM3S2D93-IQC80-A1T | TI | 100-LQFP (14x14) | New | 詳細(xì) | |
| SN74AUP1T97YZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 詳細(xì) |
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